Display device

ABSTRACT

A display apparatus comprises a substrate including a display area and a non-display area adjacent to the display area, a plurality of pixels disposed in the display area, a gate driver disposed on both sides of the display area in the non-display area, the gate driver comprising a plurality of stages including a first stage and a second stage, and a plurality of gate lines extending from the gate driver to the display area, wherein the plurality of gate lines include a first gate line including a linear portion and coupled to the first stage, and a second gate line including a linear portion and a curved portion and coupled to the second stage, and wherein a size of the second stage may be larger than a size of the first stage.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No.10-2021-0193495, filed on Dec. 30, 2021, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND Technical Field

The present disclosure relates to a display apparatus in which alight-emitting device is disposed on a display area of a devicesubstrate.

Description of the Related Art

Generally, a display apparatus provides an image to user. For example,the display apparatus may include a plurality of light-emitting device.Each of the light-emitting devices may emit light displaying a specificcolor. For example, the light-emitting device may include alight-emitting layer disposed between a first electrodes and a secondelectrode.

The light-emitting layer may be vulnerable to moisture. For example, inthe display apparatus, a device substrate in which the light-emittingdevices are formed may be bonded to an encapsulation substrate by usinga front adhesive layer. The front adhesive layer and the encapsulationsubstrate may block the penetration of external moisture, and relieveexternal impact.

BRIEF SUMMARY

The front adhesive layer used in the related art, for example, mayinclude moisture-absorbing particles, and the encapsulation substratemay include a metal. The penetration of external moisture may also bemade from a side surface of the display apparatus. However, if the bezelarea is increased for blocking the penetration of the external moisturethrough the side of the display apparatus, a display area of the displayapparatus may be reduced.

In addition, in the display apparatus, the light-emitting devices may bedamaged in a process of separating the encapsulation substrate forre-work by the adhesive force of the front adhesive layer. For example,in the display apparatus, a gap may be generated between thelight-emitting layer and the second electrode of each light-emittingdevice in the process of separating the encapsulation substrate. Thus,in the display apparatus, the quality of the image may be deteriorated,and the process efficiency and the productivity may be decreased.

Accordingly, one or more embodiments of the present disclosure isdirected to a display apparatus that substantially obviates one or moretechnical problems due to limitations and disadvantages of the relatedart including the problems identified above.

One or more embodiments of the present disclosure provide a displayapparatus capable of preventing the penetration of the external moistureand improving the process efficiency and the productivity.

One or more embodiments of the present disclosure provide a displayapparatus capable of separating the encapsulation substrate without thedamage of the light-emitting device.

Additional advantages, technical benefits, and features of thedisclosure will be set forth in part in the description which followsand in part will become apparent to those having ordinary skill in theart upon examination of the following or may be learned from practice ofthe disclosure. The benefits and other advantages of the disclosure maybe realized and attained by the structure particularly pointed out inthe written description and claims hereof as well as the appendeddrawings.

According to one embodiment, a display apparatus comprising a devicesubstrate is provided. The device substrate includes a display area anda bezel area. An over-coat layer is disposed on the display area and thebezel area of the device substrate. A light-emitting device is disposedon the over-coat layer of the display area. A moisture-blocking hole isdisposed on the bezel area of the device substrate. Themoisture-blocking hole penetrates the over-coat layer of the bezel area.An encapsulating element is disposed on the light-emitting device. Theencapsulating element fills at least a portion of the moisture-blockinghole. The encapsulating element is covered by a front adhesive layer. Anencapsulation substrate is disposed on the front adhesive layer. Theencapsulation substrate overlaps the display area and the bezel area ofthe device substrate. A variable adhesive layer is disposed between theencapsulating element and the front adhesive layer.

The variable adhesive layer may include an adhesive material layer andvariable beads. The variable beads may be dispersed in the adhesivematerial layer. The variable beads may include a material in which avolume is changed by heat or UV.

The encapsulating element may have a stacked structure of an inorganicencapsulating layer and an organic encapsulating layer. The inorganicencapsulating layer may include an inorganic insulating material. Theorganic encapsulating layer may include an organic insulating material.

An end of the organic encapsulating layer may be disposed in themoisture-blocking hole.

The variable adhesive layer may extend outside the display area alongbetween the encapsulating element and the front adhesive layer.

An end of the variable adhesive layer may be in contact with theover-coat layer of the bezel area.

In another embodiment, there is provided a display apparatus comprisinga device substrate. A first electrode is disposed on a display area ofthe device substrate. An over-coat layer is disposed between the devicesubstrate and the first electrode. The over-coat layer extends onto abezel of the device substrate. An edge of the first electrode is coveredby a bank insulating layer. The bank insulating layer extends on theover-coat layer of the bezel area. A light-emitting layer and a secondelectrode are stacked on a portion of the first electrode exposed by thebank insulating layer. The light-emitting layer and the second electrodeextend on the bezel area of the device substrate along a surface of thebank insulating layer. A moisture-blocking hole is disposed on the bezelarea of the device substrate. The moisture-blocking hole penetrates theover-coat layer, the bank insulating layer, the light-emitting layer andthe second electrode of the bezel area. An encapsulating element isdisposed on the second electrode. The encapsulating element extendsinside the moisture-blocking hole. A front adhesive layer is disposed onthe encapsulating element. The front adhesive layer extends outside themoisture-blocking hole. An encapsulation substrate is disposed on thefront adhesive layer. The encapsulation substrate overlaps the displayarea and the bezel area of the device substrate. An outer variableadhesive layer is disposed outside the bank insulating layer, thelight-emitting layer and the second electrode. The outer variableadhesive layer is disposed between the over-coat layer and the frontadhesive layer of the bezel area.

The outer variable adhesive layer may have a closed curve shapeextending along an edge of the display area.

An inner variable adhesive layer may be disposed between theencapsulating element and the front adhesive layer of the display area.The inner variable adhesive layer may extend outside the display area.The inner variable adhesive layer may be spaced away from the outervariable adhesive layer.

The inner variable adhesive layer may include the same material as theouter variable adhesive layer.

The moisture-blocking hole may be disposed between the inner variableadhesive layer and the outer variable adhesive layer.

The encapsulating element may include an organic encapsulating layer andan inorganic encapsulating layer. The inorganic encapsulating layer maybe disposed on the organic encapsulating layer. The inorganicencapsulating layer may be spaced away from the inner variable adhesivelayer.

The inner variable adhesive layer may be in contact with the organicencapsulating layer.

The inorganic encapsulating layer may include a region overlapping withthe moisture-blocking hole.

A capping layer may be disposed between the second electrode and theencapsulating element of the display area. The capping layer may extendonto the bezel area of the device substrate. The moisture-blocking holemay penetrate the capping layer.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the present disclosure and are incorporated in andconstitute a part of this application, illustrate embodiment(s) of thepresent disclosure and together with the description serve to explainthe principle of the present disclosure. In the drawings:

FIG. 1 is a view schematically showing a display apparatus according toan embodiment of the present disclosure;

FIG. 2 is a view showing a circuit of a pixel area in the displayapparatus according to the embodiment of the present disclosure;

FIG. 3A is a view showing a cross section of the pixel area in thedisplay apparatus according to the embodiment of the present disclosure;

FIG. 3B is a view taken along I-I′ of FIG. 1 ;

FIGS. 4 and 5 are views showing the state of a variable adhesive layeraccording to external environment in the display apparatus according tothe embodiment of the present disclosure;

FIG. 6 is a view of a variable adhesive layer covering only a portion ofa display area of the display apparatus according to an embodiment ofthe present disclosure;

FIG. 7 is a view of a variable adhesive layer covering only a portion ofa display area of the display apparatus according to another embodimentof the present disclosure;

FIG. 8A is a cross-sectional view showing an encapsulating elementhaving various stacked structures in a pixel area of a display apparatusaccording to an embodiment of the present disclosure;

FIG. 8B is a view taken along I-I′ of FIG. 1 according to anotherembodiment of the present disclosure including an encapsulating elementhaving various stacked structures;

FIG. 9 is a view of a variable adhesive layer disposed between anover-coat layer and a front adhesive layer of a bezel area according toan embodiment of the present disclosure;

FIG. 10A is a view showing a cross section of the pixel area in thedisplay apparatus according to the embodiment shown in FIG. 9 ;

FIG. 10B is a view taken along I-I′ of FIG. 9 ;

FIG. 11 is a view of a variable adhesive layer having an inner variableadhesive layer and an outer variable adhesive layer in a displayapparatus according to another embodiment of the present disclosure;

FIG. 12A is a view showing a cross section of the pixel area in thedisplay apparatus according to the embodiment shown in FIG. 11 ; and

FIG. 12B is a view taken along I-I′ of FIG. 11 .

DETAILED DESCRIPTION

Hereinafter, details related to the above objects, technicalconfigurations, and operational effects of the embodiments of thepresent disclosure will be clearly understood by the following detaileddescription with reference to the drawings, which illustrate someembodiments of the present disclosure. Here, the embodiments of thepresent disclosure are provided in order to allow the technical sprit ofthe present disclosure to be satisfactorily transferred to those skilledin the art, and thus the present disclosure may be embodied in otherforms and is not limited to the embodiments described below.

In addition, the same or extremely similar elements may be designated bythe same reference numerals throughout the specification and in thedrawings, the lengths and thickness of layers and regions may beexaggerated for convenience. It will be understood that, when a firstelement is referred to as being “on” a second element, although thefirst element may be disposed on the second element so as to come intocontact with the second element, a third element may be interposedbetween the first element and the second element.

Here, terms such as, for example, “first” and “second” may be used todistinguish any one element with another element. However, the firstelement and the second element may be arbitrary named according to theconvenience of those skilled in the art without departing the technicalsprit of the present disclosure.

The terms used in the specification of the present disclosure are merelyused in order to describe particular embodiments, and are not intendedto limit the scope of the present disclosure. For example, an elementdescribed in the singular form is intended to include a plurality ofelements unless the context clearly indicates otherwise. In addition, inthe specification of the present disclosure, it will be furtherunderstood that the terms “comprises” and “includes” specify thepresence of stated features, integers, steps, operations, elements,components, and/or combinations thereof, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or combinations.

And, unless ‘directly’ is used, the terms “connected” and “coupled” mayinclude that two components are “connected” or “coupled” through one ormore other components located between the two components.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andshould not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Embodiment

FIG. 1 is a view schematically showing a display apparatus according toan embodiment of the present disclosure. FIG. 2 is a view showing acircuit of a pixel area in the display apparatus according to theembodiment of the present disclosure. FIG. 3A is a view showing a crosssection of the pixel area in the display apparatus according to theembodiment of the present disclosure. FIG. 3B is a view taken along I-I′of FIG. 1 .

Referring to FIGS. 1, 2, 3A and 3B, the display apparatus according tothe embodiment of the present disclosure may include a display panel DP,a data driver DD, a gate driving GD, a timing controller TC and a powerunit PU.

The display panel DP may generate an image being provided to a user. Forexample, the display panel DP may include a plurality of pixel area PA.The data driver DD, the gate driver GD, the timing controller TC and thepower unit PU may provide a signal for the operation of each pixel areaPA through signal lines DL, GL and PL. The signal lines DL, GL and PLmay include data lines DL, gate lines GL and power voltage supply linesPL. For example, the data driver DD may apply a data signal to eachpixel area PA through the data lines DL, the gate driver GD may apply agate signal to each pixel area PA through the gate lines GL, and thepower unit PU may supply a power voltage to each pixel area PA throughthe power voltage supply lines PL. The timing controller TC may controlthe data driver DD and the gate driver GD. For example, the data driverDD may receive digital video data and a source timing control signalfrom the timing controller TC, and the gate driver GD may receive clocksignals, reset clock signals and start signals from the timingcontroller TC.

Each of the pixel areas PA may realize a specific color. For example, alight-emitting device 300 may be disposed in each pixel area PA. Thelight-emitting device 300 may emit light realizing a specific color. Forexample, the light-emitting device 300 may include a first electrode310, a light-emitting layer 320 and a second electrode 330, which aresequentially stacked on a device substrate 100. The device substrate 100may include an insulating material. The device substrate 100 may includea transparent material. For example, the device substrate 100 mayinclude glass or plastic.

The first electrode 310 may include a conductive material. The firstelectrode 310 may have a high transmittance. For example, the firstelectrode 310 may be a transparent electrode made of a transparentconductive material, such as ITO and IZO.

The light-emitting layer 320 may generate light having luminancecorresponding to a voltage difference between the first electrode 310and the second electrode 330. For example, the light-emitting layer 320may include an emission material layer (EML) having an emissionmaterial. The emission material may include an organic material, aninorganic material or a hybrid material. For example, the displayapparatus according to the embodiment of the present disclosure may bean organic light-emitting display apparatus including an organicemission material.

The light-emitting layer 320 may have a multi-layer structure. Forexample, the light-emitting layer 320 may further include at least oneof a hole injection layer (HIL), a hole transport layer (HTL), anelectron transport layer (ETL) and an electron injection layer (EIL).Thus, in the display apparatus according to the embodiment of thepresent disclosure, the emission efficiency of the light-emitting layer320 may be improved.

The second electrode 330 may include a conductive material. The secondelectrode 330 may include a material different from the first electrode310. The reflectance of the second electrode 330 may be higher than thereflectance of the first electrode 310. For example, the secondelectrode 330 may include a metal, such as aluminum (Al) and silver(Ag). Thus, in the display apparatus according to the embodiment of thepresent disclosure, the light generated by the light-emitting layer 320may be emitted outside through the first electrode 310 and the devicesubstrate 100.

The pixel driving circuit DC electrically connected to thelight-emitting device 300 may be disposed in each pixel area PA. Theoperation of the light-emitting device 300 in each pixel area PA may becontrolled by the pixel driving circuit DC of the corresponding pixelarea PA. The pixel driving circuit DC of each pixel area PA may beelectrically connected to one of the data lines DL, one of the gatelines GL, and one of the power voltage supply lines PL. For example, thepixel driving circuit DC of each pixel area PA may supply a drivingcurrent corresponding to the data signal to the light-emitting device300 of the corresponding pixel area PA according to the gate signal. Thedriving current generated by the pixel driving circuit DC of each pixelarea PA may apply to the light-emitting device 300 of the correspondingpixel area PA for one frame. For example, the pixel driving circuit DCof each pixel area PA may include a first thin film transistor T1, asecond thin film transistor T2 and a storage capacitor Cst.

The first thin film transistor T1 may include a first semiconductorpattern, a first gate electrode, a first source electrode and a firstdrain electrode. The second thin film transistor T2 may have the samestructure as the first thin film transistor T1. For example, the secondthin film transistor T2 may include a second semiconductor pattern 221,a second gate electrode 223, a second source electrode 225 and a seconddrain electrode 227.

The first semiconductor pattern and the second semiconductor pattern 221may include a semiconductor material. For example, the firstsemiconductor pattern and the second semiconductor pattern 221 mayinclude an oxide semiconductor, such as IGZO. The second semiconductorpattern 221 may include the same material as the first semiconductorpattern. For example, the second semiconductor pattern 221 may bedisposed on the same layer as the first semiconductor pattern. Thesecond semiconductor pattern 221 may be formed simultaneously with thefirst semiconductor pattern.

Each of the first semiconductor pattern and the second semiconductorpattern 221 may include a source region, a channel region and a drainregion. The channel region may be disposed between the source region andthe drain region. The source region and the drain region may have aresistance lower than the channel region. For example, the source regionand the drain region may include a conductorized region of an oxidesemiconductor. The channel region may be a region of an oxidesemiconductor, which may be not a conductorized.

The first gate electrode and the second gate electrode 223 may include aconductive material. For example, the first gate electrode and thesecond gate electrode 223 may include a metal, such as aluminum (Al),chrome (Cr), copper (Cu), molybdenum (Mo), titanium (Ti) and tungsten(W). The second gate electrode 223 may include the same material as thefirst gate electrode. For example, the second gate electrode 223 may bedisposed on the same layer as the first gate electrode. The second gateelectrode 223 may be formed simultaneously with the first gateelectrode.

The first gate electrode may be disposed on the first semiconductorpattern. For example, the first gate electrode may overlap the channelregion of the first semiconductor pattern. The first gate electrode maybe insulated from the first semiconductor pattern. For example, thechannel region of the first semiconductor pattern may have an electricconductivity corresponding to a voltage applied to the first gateelectrode. The second gate electrode 223 may be disposed on the secondsemiconductor pattern 221. For example, the second gate electrode 223may overlap the channel region of the second semiconductor pattern 221.The second gate electrode 223 may be insulated from the secondsemiconductor pattern 221. The channel region of the secondsemiconductor pattern 221 may have an electric conductivitycorresponding to a voltage applied to the second gate electrode 223.

The first source electrode, the first drain electrode, the second sourceelectrode 225 and the second drain electrode 227 may include aconductive material. For example, the first source electrode, the firstdrain electrode, the second source electrode 225 and the second drainelectrode 227 may include a metal, such as aluminum (Al), chrome (Cr),copper (Cu), molybdenum (Mo), titanium (Ti) and tungsten (W). The firstdrain electrode may include the same material as the first sourceelectrode. For example, the first drain electrode may be disposed on thesame layer as the first source electrode. The first drain electrode maybe formed simultaneously with the first source electrode. The seconddrain electrode 227 may include the same material as the second sourceelectrode 225. For example, the second drain electrode 227 may bedisposed on the same layer as the second source electrode 225. Thesecond drain electrode 227 may be formed simultaneously with the secondsource electrode 225.

The first source electrode and the first drain electrode may include thesame material as the first gate electrode. For example, the first sourceelectrode and the first drain electrode may be disposed on the samelayer as the first gate electrode. The first source electrode and thefirst drain electrode may be formed simultaneously with the first gateelectrode. The first source electrode and the first drain electrode maybe insulated from the first gate electrode. For example, the firstsource electrode and the first drain electrode may be spaced away fromthe first gate electrode.

The second source electrode 225 and the second drain electrode 227 mayinclude the same material as the second gate electrode 223. For example,the second source electrode 225 and the second drain electrode 227 maybe disposed on the same layer as the second gate electrode 223. Thesecond source electrode 225 and the second drain electrode 227 may beformed simultaneously with the second gate electrode 223. The secondsource electrode 225 and the second drain electrode 227 may be insulatedfrom the second gate electrode 223. For example, the second sourceelectrode 225 and the second drain electrode 227 may be spaced away fromthe second gate electrode 223.

The first source electrode may be electrically connected to the sourceregion of the first semiconductor pattern. The first drain electrode maybe electrically connected to the drain region of the first semiconductorpattern. The second source electrode 225 may be electrically connectedto the source region of the second semiconductor pattern 221. The seconddrain electrode 227 may be electrically connected to the drain region ofthe second semiconductor pattern 221. The second source electrode 225and the second drain electrode 227 may include the same material as thefirst source electrode and the first drain electrode. For example, thesecond source electrode 225 and the second drain electrode 227 may bedisposed on the same layer as the first source electrode and the firstdrain electrode. The second source electrode 225 and the second drainelectrode 227 may be formed simultaneously with the first sourceelectrode and the first drain electrode. The first source electrode, thefirst drain electrode, the second source electrode 225 and the seconddrain electrode 227 may be spaced away from each other.

The thin film transistors T1 and T2 of each pixel area PA may bedisposed between the device substrate 100 and the light-emitting device300 of the corresponding pixel area PA. At least one of insulatinglayers 110, 120, 130, 140 and 150 may be disposed on the devicesubstrate 100. Thus, in the display apparatus according to theembodiment of the present disclosure, unnecessary connection between thethin film transistors T1 and T2 and the light-emitting device 300 ofeach pixel area PA may be prevented. For example, a device buffer layer110, a gate insulating layer 120, a lower passivation layer 130, anover-coat layer 140 and a bank insulating layer 150 may be disposed onthe device substrate 100.

The device buffer layer 110 may include an insulating material. Forexample, the device buffer layer 110 may include an inorganic insulatingmaterial, such as silicon oxide (SiO) and silicon nitride (SiN). Thedevice buffer layer 110 may include a multi-layer structure. Forexample, the device buffer layer 110 may have a stacked structure of alayer made of silicon nitride (SiN) and a layer made of silicon oxide(SiO).

The device buffer layer 110 may be disposed between the device substrate100 and the thin film transistors T1 and T2 of each pixel area PA. Thedevice buffer layer 110 may prevent pollution due to the devicesubstrate 100 in a process of forming the thin film transistors T1 andT2. For example, an entire surface of the device substrate 100 towardthe thin film transistors T1 and T2 of each pixel area PA may be coveredby the device buffer layer 110. The thin film transistors T1 and T2 ofeach pixel area PA may be disposed on the device buffer layer 110.

The gate insulating layer 120 may include an insulating material. Forexample, the gate insulating layer 120 may include an inorganicinsulating material, such as silicon oxide (SiO) and silicon nitride(SiN). The gate insulating layer 120 may include a material having ahigh dielectric constant. For example, the gate insulating layer 120 mayinclude a High-K material, such as hafnium oxide (HfO). The gateinsulating layer 120 may have a multi-layer structure.

The gate insulating layer 120 may be disposed on the device buffer layer110. The gate insulating layer 120 may extend between the semiconductorpattern 221 and the gate electrode 223 of each thin film transistor T1and T2. For example, the gate electrode 223 of each thin film transistorT1 and T2 may be insulated from the semiconductor pattern 221 of thecorresponding thin film transistor T1 and T2 by the gate insulatinglayer 120. The gate insulating layer 120 may cover the firstsemiconductor pattern and the second semiconductor pattern 221 of eachpixel area PA. The first gate electrode and the second gate electrode223 of each pixel area PA may be disposed on the gate insulating layer120.

The first source electrode, the first drain electrode 217, the secondsource electrode 225 and the second drain electrode 227 of each pixelarea PA may be disposed on the gate insulating layer 120. For example,the gate insulating layer 120 of each pixel area PA may include a firstsource contact hole exposing the source region of the firstsemiconductor pattern, a first drain contact hole exposing the drainregion of the first semiconductor pattern, a second source contact holeexposing the source region of the second semiconductor pattern 221, anda second drain contact hole exposing the drain region of the secondsemiconductor pattern 221.

The lower passivation layer 130 may include an insulating material. Forexample, the lower passivation layer 130 may include an inorganicinsulating material, such as silicon oxide (SiO) and silicon nitride(SiN).

The lower passivation layer 130 may be disposed on the gate insulatinglayer 120. The lower passivation layer 130 may prevent the damage ofeach thin film transistor T1 and T2 due to external impact and moisture.For example, the first gate electrode, the first source electrode, thefirst drain electrode, the second gate electrode 223, the second sourceelectrode 225 and the second drain electrode 227 of each pixel area PAmay be covered by the lower passivation layer 130. The lower passivationlayer 130 may extend along a surface of each thin film transistor T1 andT2 opposite to the device substrate 100. The lower passivation layer 130may be in direct contact with the gate insulating layer 120 at theoutside of the thin film transistors T1 and T2 in each pixel area PA.

The over-coat layer 140 may include an insulating material. Theover-coat layer 140 may include a material different from the lowerpassivation layer 130. For example, the over-coat layer 140 may includean organic insulating material.

The over-coat layer 140 may be disposed on the lower passivation layer130. The over-coat layer 140 may remove a thickness difference due tothe thin film transistors T1 and T2 of each pixel area PA. For example,an upper surface of the over-coat layer 140 opposite to the devicesubstrate 100 may be a flat surface. The first electrode 310, thelight-emitting layer 320 and the second electrode 330 of thelight-emitting device 300 may be sequentially stacked on the uppersurface of the over-coat layer 140. Thus, in the display apparatusaccording to the embodiment of the present disclosure, thecharacteristics deviation due to the generating position difference ofthe light emitted outside through the device substrate 100 may beprevented.

The bank insulating layer 150 may include an insulating material. Forexample, the bank insulating layer 150 may include an organic insulatingmaterial. The bank insulating layer 150 may include a material differentfrom the over-coat layer 140.

The bank insulating layer 150 may be disposed on the over-coat layer140. The first electrode 310 of each light-emitting device 300 may beinsulated from the first electrode 310 of adjacent light-emitting device300 by the bank insulating layer 150. For example, the bank insulatinglayer 150 may cover an edge of the first electrode 310 in each pixelarea PA. Thus, in the display apparatus according to the embodiment ofthe present disclosure, the light-emitting device 300 of each pixel areaPA may be independently controlled by the bank insulating layer 150. Thelight-emitting layer 320 and the second electrode 330 of eachlight-emitting device 300 may be stacked on a portion of thecorresponding first electrode 310 exposed by the bank insulating layer150. For example, the bank insulating layer 150 may define emission areaEA.

The emission area EA of each pixel area PA defined by the bankinsulating layer 150 may be not overlap with the pixel driving circuitDC of the corresponding pixel area PA. For example, the thin filmtransistors T1 and T2 of each pixel area PA may be disposed outside theemission area EA of the corresponding pixel area PA. Thus, in thedisplay apparatus according to the embodiment of the present disclosure,the light emitted from the light-emitting device 300 of each pixel areaPA may be not blocked by the thin film transistors T1 and T2 of thecorresponding pixel area PA.

The light-emitting layer 320 of each light-emitting device 300 may beconnected to the light-emitting layer 320 of adjacent light-emittingdevice 300. For example, the light-emitting layer 320 of eachlight-emitting device 300 may extend on the bank insulating layer 150.The light emitted from the light-emitting device 300 of each pixel areaPA may display the same color as the light emitted from thelight-emitting device 300 of adjacent pixel area PA. For example, thelight-emitting layer 320 of each pixel area PA may generate white light.

Each of the pixel areas PA may realize a color different from adjacentpixel area PA. For example, each of the pixel area PA may include acolor filter 400 overlapping with the emission area EA of thecorresponding pixel area PA. The color filter 400 may realize a specificcolor using the light passing through the corresponding color filter400. For example, the color filter 400 of each pixel area PA may bedisposed on a path of the light emitted from the light-emitting device300 in the corresponding pixel area PA. The color filter 400 of eachpixel area PA may be disposed between the device substrate 100 and thelight-emitting device 300 of the corresponding pixel area PA. Forexample, the color filter 400 of each pixel area PA may be disposedbetween the device passivation layer 130 and the over-coat layer 140. Athickness difference due to the color filter 400 of each pixel area PAmay be removed by the over-coat layer 140.

A voltage applied to the second electrode 330 of each light-emittingdevice 300 may be the same as a voltage applied to the second electrode330 of adjacent light-emitting device 300. For example, the secondelectrode 330 of each light-emitting device 300 may be electricallyconnected to the second electrode 330 of adjacent light-emitting device300. The second electrode 330 of each light-emitting device 300 mayinclude the same material as the second electrode 330 of adjacentlight-emitting device 300. For example, the second electrode 330 of eachlight-emitting device 300 may be formed simultaneously with the secondelectrode 330 of adjacent light-emitting device 300. Thus, in thedisplay apparatus according to the embodiment of the present disclosure,a process of forming the second electrode 330 of each light-emittingdevice 300 may be simplified.

A light-blocking pattern 250 may be disposed between the devicesubstrate 100 and each thin film transistor T1 and T2. For example, thelight-blocking pattern 250 may be disposed between the device substrate100 and the device buffer layer 110. The light-blocking pattern 250 mayinclude a material capable of absorbing or reflecting the light. Thelight-blocking pattern 250 may include a conductive material. Forexample, the light-blocking pattern 250 may include a metal, such asaluminum (Al), chrome (Cr), copper (Cu), molybdenum (Mo), titanium (Ti)and tungsten (W).

External light travelling in a direction of the semiconductor pattern221 of each thin film transistor T1 and T2 may be blocked by thelight-blocking pattern 250. For example, the semiconductor pattern 221of each thin film transistor T1 and T2 may include a region overlappingwith the light-blocking pattern 250. Thus, in the display apparatusaccording to the embodiment of the present disclosure, a characteristicschange of each thin film transistor T1 and T2 due to the external lightmay be prevented.

The first thin film transistor T1 of each pixel driving circuit DC maytransmit the data signal to the second thin film transistor T2 of thecorresponding pixel driving circuit DC according to the gate signal. Forexample, the first gate electrode of each pixel driving circuit DC maybe electrically connected to one of the gate lines GL, and the firstsource electrode of each pixel driving circuit DC may be electricallyconnected to one of the data lines DL. The second thin film transistorT2 of each pixel driving circuit DC may generate the driving currentcorresponding to the data signal. For example, the second gate electrode223 of each pixel driving circuit DC may be electrically connected tothe first drain electrode of the corresponding pixel driving circuit DC,and the second source electrode 225 of each pixel driving circuit DC maybe electrically connected to one of the power voltage supply lines PL.The driving current generated by the second thin film transistor T2 ofeach pixel area PA may be provided to the light-emitting device 300 ofthe corresponding pixel area PA. For example, the first electrode 310 ofeach pixel area PA may be electrically connected to the second drainelectrode 227 of the corresponding pixel area PA.

The gate lines GL may be disposed on the same layer as the gateelectrode 223 of each thin film transistor T1 and T2. For example, thegate lines GL may be disposed between the gate insulating layer 120 andthe lower passivation layer 130. The gate lines GL may include the samematerial as the gate electrode 223 of each thin film transistor T1 andT2. For example, the gate lines GL may be formed simultaneously with thegate electrode 223 of each thin film transistor T1 and T2. The firstgate electrode of each pixel area PA may be in direct contact with thecorresponding gate line GL.

The data lines DL may intersect the gate lines GL. The data lines DL maybe disposed on a layer different from the gate lines GL. For example,the data lines DL may be disposed between the device substrate 100 andthe device buffer layer 110. The data lines DL may include the samematerial as the light-blocking pattern 250. For example, the data linesDL may be formed simultaneously with the light-blocking pattern 250. Thedevice buffer layer 110 and the gate insulating layer 120 may includedata contact holes exposing a portion of each data line DL. The firstsource electrode of each pixel area PA may be connected to thecorresponding data line DL through one of the data contact holes.

The power voltage supply lines PL may extend in parallel to the datalines DL. For example, the power voltage supply lines PL may intersectthe gate lines GL. The power voltage supply lines PL may be disposed onthe same layer as the data lines DL. For example, the power voltagesupply lines PL may be disposed between the device substrate 100 and thedevice buffer layer 110. The power voltage supply lines PL may includethe same material as the data lines DL. For example, the power voltagesupply lines PL may be formed simultaneously with the data lines DL. Thedevice buffer layer 110 and the gate insulating layer 120 may includepower contact holes exposing a portion of each power voltage supply linePL. The second source electrode 225 of each pixel area PA may beconnected to the corresponding power voltage supply line PL through oneof the power contact holes.

The storage capacitor Cst of each pixel driving circuit DC may maintaina signal applied to the second gate electrode 223 of the correspondingpixel driving circuit DC for one frame. For example, the storagecapacitor Cst of each pixel driving circuit DC may be electricallyconnected between the second gate electrode 223 and the second drainelectrode 227 of the corresponding pixel driving circuit DC. The storagecapacitor Cst of each pixel driving circuit DC may have a stackedstructure of at least two capacitor electrodes 231 and 232. For example,the storage capacitor Cst of each pixel driving circuit DC may have astacked structure of a first capacitor electrode 231 and a secondcapacitor electrode 232. The second capacitor electrode 232 of eachpixel driving circuit DC may be disposed on the first capacitorelectrode 231 of the corresponding pixel driving circuit DC. The secondcapacitor electrode 232 of each pixel driving circuit DC may beinsulated from the first capacitor electrode 231 of the correspondingpixel driving circuit DC. The storage capacitor Cst of each pixeldriving circuit DC may be formed using a conductive layer disposedbetween the device substrate 100 and the over-coat layer 140. Forexample, the first capacitor electrode 231 of each pixel driving circuitDC may be disposed between the device substrate 100 and the devicebuffer layer 110, and the second capacitor electrode 232 of each pixeldriving circuit DC may be disposed between the device buffer layer 110and the gate insulating layer 120.

The first capacitor electrode 231 of each pixel driving circuit DC mayinclude the same material as the light-blocking pattern 250. Forexample, the first capacitor electrode 231 of each pixel driving circuitDC may include a metal, such as aluminum (Al), chrome (Cr), copper (Cu),molybdenum (Mo), titanium (Ti), tungsten (W), or some combinationthereof. The first capacitor electrode 231 of each pixel driving circuitDC may be formed simultaneously with the light-blocking pattern 250. Forexample, the first capacitor electrode 231 of each pixel driving circuitDC may be in direct contact with the light-blocking pattern 250 disposedin the corresponding pixel area PA.

The first capacitor electrode 231 of each pixel driving circuit DC maybe electrically connected to the second drain electrode 227 of thecorresponding pixel driving circuit DC. For example, the first capacitorelectrode 231 of each pixel driving circuit DC may be connected to thesecond drain electrode 227 of the corresponding pixel driving circuit DCby the light-blocking pattern 250 and the drain region of the secondsemiconductor pattern 221, which are disposed in the corresponding pixelarea PA. The drain region of the second semiconductor pattern 221 ineach pixel area PA may be electrically connected to the light-blockingpattern 250 in the corresponding pixel area PA. For example, the devicebuffer layer 110 may include storage contact holes between thelight-blocking pattern 250 and the drain region of the secondsemiconductor pattern 221 in each pixel area PA. The drain region of thesecond semiconductor pattern 221 in each pixel area PA may be connectedto the light-blocking pattern 250 in the corresponding pixel area PAthrough one of the storage contact holes.

The second capacitor electrode 232 of each pixel driving circuit DC mayinclude the same material as the semiconductor patterns 221 of thecorresponding pixel driving circuit DC. For example, the secondcapacitor electrode 232 of each pixel driving circuit DC may include anoxide semiconductor, such as IGZO. The second capacitor electrode 232 ofeach pixel driving circuit DC may be formed simultaneously with thesemiconductor patterns 221 of the corresponding pixel driving circuitDC. The second capacitor electrode 232 of each pixel driving circuit DCmay have a resistance lower than the channel region of eachsemiconductor pattern 221 disposed in the corresponding pixel drivingcircuit DC. For example, the second capacitor electrode 232 of eachpixel driving circuit DC may include a conductorized region of an oxidesemiconductor.

The display panel DP may include a display area AA in which the pixelareas PA are disposed, and a bezel area BZ disposed outside the displayarea AA. For example, the light-emitting devices 300 may be disposed onthe over-coat layer 130 of the display area AA. The bezel area BZ maysurround the display area AA. Signal wirings DL, GL and PL may beconnected to the pixel driving circuit DC of each pixel area PA bypassing through the bezel area BZ. For example, the data lines DL, thegate lines GL and the power voltage supply lines PL, which areelectrically connected to the pixel driving circuit DC of each pixelarea PA may extend on the bezel area BZ of the device substrate 100.

At least one of insulating layers 110, 120, 130, 140 and 150 forinsulating between the signal wirings DL, GL and PL may be disposed onthe bezel area BZ of the device substrate 100. For example, the devicebuffer layer 110, the gate insulating layer 120, the lower passivationlayer 130, the over-coat layer 140 and the bank insulating layer 150 mayextend onto the bezel area BZ of the device substrate 100. The devicebuffer layer 110, the gate insulating layer 120, the lower passivationlayer 130, the over-coat layer 140 and the bank insulating layer 150 maybe sequentially stacked on the bezel area BZ of the device substrate 100

A blocking pattern BH is also referred to as a moisture-blocking hole BHthroughout the disclosure. Therefore, the term blocking pattern BH andthe moisture-blocking hole BH may be used interchangeably. However, theblocking pattern BH is not limited to merely blocking moisture and thestructure is also capable of blocking any foreign, external materialsthat can degrade the function of the light-emitting device. Themoisture-blocking hole BH may be disposed on the bezel area BZ of thedevice substrate 100. The moisture-blocking hole BH may block thepenetration of external moisture through the insulating layers 110, 120,130, 140 and 150, which are disposed on the bezel area BZ. For example,the moisture-blocking hole BH may penetrate the over-coat layer 140 andthe bank insulating layer 150, which are made of an organic insulatingmaterial. A portion of the lower passivation layer 130 being made of aninorganic insulating material may be exposed by the moisture-blockinghole BH. Thus, in the display apparatus according to the embodiment ofthe present disclosure, the penetration of the external moisture intothe display area AA may be blocked by the moisture-blocking hole BH.Therefore, in the display apparatus according to the embodiment of thepresent disclosure, the deterioration of the light-emitting layer 320due to the external moisture may be prevented.

The light-emitting layer 320 and the second electrode 330 of eachlight-emitting device 300 may extend onto the bezel area BZ of thedevice substrate 100. The moisture-blocking hole BH may extends through(or penetrate) the light-emitting layer 320 and the second electrode 330of each light-emitting device 300 on the bezel area BZ. Thus, in thedisplay apparatus according to the embodiment of the present disclosure,the penetration of the external moisture may be effectively prevented. Aregion having a minimum area for securing the reliability of moisturepermeation prevention within the bezel area BZ may be referred to as areliability bezel region. The reliability bezel region may be definedfrom an end of an encapsulation substrate 900 to an end of the secondelectrode 330. The moisture-blocking hole BH may penetrate thelight-emitting layer 320 and the second electrode 330 of eachlight-emitting device 300 on the bezel area BZ, such that thereliability bezel region may be expanded by a difference between an endA of the second electrode 330 which is not penetrated, and an end B ofthe second electrode 330 which is penetrated. The moisture-blocking holeBH may be disposed between the end A of the second electrode 330 whichis not penetrated, and the end B of the second electrode 330 which ispenetrated. The end B of the second electrode 330 which is penetratedmay be disposed on the same layer as the end A of the second electrode330 which is not penetrated.

The moisture-blocking hole BH may be formed using a laser ablationprocess. For example, a step of forming the moisture-blocking hole BHmay include a step of irradiating a portion of the bezel area BZ inwhich the over-coat layer 140, the bank insulating layer 150, thelight-emitting layer 320 and the second electrode 330 are stacked, tosequentially remove a portion of the second electrode 330, a portion ofthe light-emitting layer 320, a portion of the bank insulating layer150, and a portion the over-coat layer 140. This process also exposesthe side surfaces of various layers including the capping layer 500, thesecond electrode 330, the light-emitting layer 320, the bank insulatinglayer 150, the over-coat layer 140 as shown in FIG. 3B. Thus, in thedisplay apparatus according to the embodiment of the present disclosure,the process of forming the moisture-blocking pattern may be simplified.Therefore, in the display apparatus according to the embodiment of thepresent disclosure, the process efficiency may be improved.

An encapsulating element 600 may be disposed on the second electrode 330of each light-emitting device 300. The encapsulating element 600 mayprevent the damage of the light-emitting devices 300 due to externalimpact and moisture. The encapsulating element 600 may have amulti-layer structure. For example, the encapsulating element 600 mayinclude a first encapsulating layer 610, a second encapsulating layer620 and a third encapsulating layer 630, which are sequentially stacked.The first encapsulating layer 610, the second encapsulating layer 620and the third encapsulating layer 630 may include an insulatingmaterial. The second encapsulating layer 620 may include a materialdifferent from the first encapsulating layer 610 and the thirdencapsulating layer 630. For example, the first encapsulating layer 610and the third encapsulating layer 630 may be an inorganic insulatinglayer including an inorganic insulating material, and the secondencapsulating layer 620 may be an organic insulating layer including anorganic insulating material. Thus, in the display apparatus according tothe embodiment of the present disclosure, the damage of thelight-emitting devices 300 due to the external impact and moisture maybe effectively prevented.

The encapsulating element 600 may extend onto the bezel area BZ of thedevice substrate 100. The encapsulating element 600 may fill at least aportion of the moisture-blocking hole BH. For example, the flow of thesecond encapsulating layer 620 including an organic insulating materialmay be blocked by the moisture-blocking hole BH. The moisture-blockinghole BH may have a closed curve shape extending along an edge of thedisplay area AA. For example, a formation region of the secondencapsulating layer 620 may be defined by the moisture-blocking hole BH.An end of the second encapsulating layer 620 may be disposed inside themoisture-blocking hole BH. The first encapsulating layer 610 and thethird encapsulating layer 630, which include an inorganic insulatingmaterial may extend outside the moisture-blocking hole BH. For example,the end of the second encapsulating layer 620 may be surrounded by thefirst encapsulating layer 610 and the third encapsulating layer 630.Thus, in the display apparatus according to the embodiment of thepresent disclosure, the flow of the second encapsulating layer 620 maybe blocked, without forming additional dam. Therefore, in the displayapparatus according to the embodiment of the present disclosure, theprocess efficiency may be improved.

And, in the display apparatus according to the embodiment of the presentdisclosure, the penetration of the external moisture may be prevented bythe encapsulating element 600 in the moisture-blocking hole BH. That is,in the display apparatus according to the embodiment of the presentdisclosure, the deterioration of the light-emitting layer 320 due to theexternal moisture may be significantly reduced. Therefore, in thedisplay apparatus according to the embodiment of the present disclosure,the quality of the image provided to the user may be effectivelyimproved.

In one embodiment, as shown in FIG. 3B, the moisture-blocking hole BHcompletely extends through the over-coat layer 140 and the bankinsulating layer 150. The first capping layer 610 is disposed on themoisture-blocking hole BH and covers the top surface and side surface ofthe capping layer 500 and the side surfaces of the second electrode 330,the light-emitting layer 320, the bank insulating layer 150, and theover-coat layer 140. The first capping layer 610 also directly contactsthe lower passivation layer 130. This is merely one example embodimentand the depth of the moisture-blocking hole BH may differ based onvarious designs and applications of the display device.

Referring to FIG. 3B, the third encapsulating layer 630 extends downwardtowards the moisture-blocking hole BH to contact a side surface of thefirst encapsulating layer 610. The point that the third encapsulatinglayer 630 contacts with the side surface of the first encapsulatinglayer 610 horizontally overlaps with the bank insulating layer 150 asshown in the illustration. However, in a different embodiment, a pointthat the third encapsulating layer 630 contacts with the side surface ofthe first encapsulating layer 610 may horizontally overlap with theover-coat layer 140. The variable adhesive layer 700 subsequentlydeposited over the third encapsulating layer 630 may have acorresponding shape (e.g., a V-shape, or a sawtooth like shape, or atriangular like shape) as the third encapsulating layer 630.

A capping layer 500 may be disposed between the second electrode 330 ofeach light-emitting device 300 and the encapsulating element 600. Thecapping layer 500 may relieve the external impact. The capping layer 500may include an insulating material. For example, the capping layer 500may include an inorganic insulating material, such as silicon oxide(SiO) and silicon nitride (SiN). The capping layer 500 may include amaterial different from the first encapsulating layer 610. Thus, in thedisplay apparatus according to the embodiment of the present disclosure,the deterioration of the light-emitting layer 320 due to the externalmoisture may be effectively prevented.

The capping layer 500 may extend onto the bezel area BZ of the devicesubstrate 100 along between the second electrode 330 of eachlight-emitting device 300 and the encapsulating element 600. Themoisture-blocking hole BH may penetrate the capping layer 500. Forexample, the laser ablation process for forming the moisture-blockinghole BH may be performed after forming the capping layer 500. Thus, inthe display apparatus according to the embodiment of the presentdisclosure, the flow of the second encapsulating layer 620 may beeffectively blocked by the moisture-blocking hole BH.

An encapsulation substrate 900 may be attached on the encapsulatingelement 600 by a front adhesive layer 800. The encapsulation substrate900 may prevent the damage of the light-emitting devices 300 due to theexternal impact and moisture. For example, the encapsulation substrate900 may include a material having a specific hardness or more. Theencapsulation substrate 900 may include a material having relativelyhigh thermal conductivity. For example, the encapsulation substrate 900may include a metal, such as aluminum (Al), nickel (Ni) and iron (Fe).Thus, in the display apparatus according to the embodiment of thepresent disclosure, the heat generated by the pixel driving circuit DCand the light-emitting device 300 of each pixel area PA may bedissipated through the encapsulation substrate 900. Therefore, in thedisplay apparatus according to the embodiment of the present disclosure,the deterioration of the light-emitting layers 320 may be effectivelyprevented.

The front adhesive layer 800 may include an adhesive material. The frontadhesive layer 800 may extend onto the bezel area BZ of the devicesubstrate 100. The encapsulating element 600 may be covered by the frontadhesive layer 800. For example, the front adhesive layer 800 and theencapsulation substrate 900 may overlap the display area AA and thebezel area BZ of the device substrate 100. A lower surface of theencapsulation substrate 900 toward the device substrate 100 may beparallel to an upper surface of the device substrate 100 toward theencapsulation substrate 900. For example, the front adhesive layer 800on the bezel area BZ of the device substrate 100 may be thicker than thefront adhesive layer 800 on the display area AA of the device substrate100.

FIG. 4 is an enlarged view of area K shown in FIG. 3A when the variablebeads 702 are spaced apart from each other. FIG. 5 is an enlarged viewof area K shown in FIG. 3A when the variable beads 702 are expanded tocontact each other. A variable adhesive layer 700 may be disposedbetween the encapsulating element 600 and the front adhesive layer 800of the display area AA. The adhesive force of the variable adhesivelayer 700 may be lowered under specific conditions. For example, thevariable adhesive layer 700 may include an adhesive material layer 701and variable beads 702 dispersed in the adhesive material layer 701, andthe variable beads 702 may include a material in which a volume ischanged by a specific conditions, as shown in FIG. 4 . The volume ofeach variable bead 702 may be increased by heating or UV irradiation.For example, each of the variable beads 702 may be a thermallyexpandable microcapsule containing hydrocarbons that expand by heating(e.g., temperature). Thus, in the display apparatus according to theembodiment of the present disclosure, if the variable adhesive layer 700is heated or UV is irradiated to the variable adhesive layer 700, thevolume of each variable bead 702 may be increased, and the adhesivematerial layer 701 may be separated from the inside, as shown in FIG. 5. That is, in the display apparatus according to the embodiment of thepresent disclosure, the adhesive force of the variable adhesive layer700 may be lowered by an increase in the volume of each variable bead702. Therefore, in the display apparatus according to the embodiment ofthe present disclosure, the coupling force between the encapsulatingelement 600 and the front adhesive layer 800 may be selectively loweredby the variable adhesive layer 700.

The variably adhesive layer 700 may extend onto the bezel area BZ of thedevice substrate 100 along between the encapsulating element 600 and thefront adhesive layer 800, as shown in FIGS. 3A and 3B. For example, anend of the variable adhesive layer 700 may be in direct contact with theover-coat layer 140 of the bezel area BZ. That is, FIG. 3B illustratesthe end of the variable adhesive layer 700 directly contacting a topsurface TS of the over-coat layer 140 in the bezel area BZ. Forinstance, an end END2 of the variably adhesive layer 700 contacts thetop surface TS of the over-coat layer 140 in the bezel area BZ. Thevariable adhesive layer 700 may extend beyond the moisture-blocking holeBH. For example, the bank insulating layer 150, the light-emitting layer320, the second electrode 330, the capping layer 500 and theencapsulating element 600 may be covered by the variable adhesive layer700. Thus, the display apparatus according to the embodiment of thepresent disclosure may reduce the adhesive force of the variableadhesive layer 700 to prevent the damage of the light-emitting devices300 due to the separation process of the encapsulation substrate 900.That is, in the display apparatus according to the embodiment of thepresent disclosure, the encapsulation substrate 900 may be separated,without the damage of the light-emitting devices 300. Therefore, in thedisplay apparatus according to the embodiment of the present disclosure,the process efficiency and the productivity may be improved.

Accordingly, in the display apparatus according to the embodiment of thepresent disclosure, the moisture-blocking hole BH may be disposed on thebezel area BZ of the device substrate 100, and the variable adhesivelayer 700 may be disposed between the encapsulating element 600 coveringthe light-emitting devices 300 and the front adhesive layer 800, whereinthe variable adhesive layer 700 in which adhesive force is lowered undera specific conditions may extend beyond the encapsulating element 600.Thus, in the display apparatus according to the embodiment of thepresent disclosure, the penetration of the external moisture may beprevented by expanding the reliability bezel region in the bezel areaBZ, and the damage of the light-emitting devices 300 due to theseparation process of the encapsulation substrate 900 for re-work may beprevented. Therefore, in the display apparatus according to theembodiment of the present disclosure, the process efficiency and theproductivity may be improved.

The display apparatus according to the embodiment of the presentdisclosure is described that the variable adhesive layer 700 covers thedisplay area AA of the device substrate 100, completely (that is,throughout the entire display area AA of the device substrate 100).However, in the display apparatus according to another embodiment of thepresent disclosure, the variable adhesive layer 700 may cover only aportion of the display area AA. For example, the display apparatusaccording to another embodiment of the present disclosure may include aplurality of variable adhesive layer 700 having a bar shape extending ina first direction, wherein the variable adhesive layer 700 may be spacedaway for each other in a second direction transverse (e.g., FIG. 6 showsit as being perpendicular) to the first direction, as shown in FIG. 6 .Alternately, in the display apparatus according to another embodiment ofthe present disclosure, a planar shape of the variable adhesive layer700 may have a specific pattern, as shown in FIG. 7 . For instance, thevariable adhesive layer 700 may have a square wave or a rectangular wavelike pattern seen from a plan view. The variable adhesive layer 700 mayalso be continuous and contiguous (contrary to the example pattern shownin FIG. 6 ). Thus, in the display apparatus according to anotherembodiment of the present disclosure, the degree of freedom for theshape of the variable adhesive layer 700 may be improved.

The display apparatus according to the embodiment of the presentdisclosure is described that the encapsulating element 600 has athree-layer structure. However, in the display apparatus according toanother embodiment of the present disclosure, the encapsulating element600 may have various stacked structures. For example, in the displayapparatus according to another embodiment of the present disclosure, theencapsulating element 600 may have a stacked structure of a firstencapsulating layer 610, a second encapsulating layer 620, a thirdencapsulating layer 630, a fourth encapsulating layer 640 and a fifthencapsulating layer 650, as shown in FIGS. 8A and 8B. The firstencapsulating layer 610, the third encapsulating layer 630 and the fifthencapsulating layer 650 may be an inorganic insulating layer includingan inorganic insulating material. The second encapsulating layer 620 andthe fourth encapsulating layer 640 may be an organic insulating layerincluding an organic insulating material. For example, an end of thesecond encapsulating layer 620 and an end of the fourth encapsulatinglayer 640 may be disposed inside the moisture-blocking hole BH. Thus, inthe display apparatus according to another embodiment of the presentdisclosure, the degree of freedom for the shape of the encapsulatingelement 600 may be improved. Therefore, in the display apparatusaccording to another embodiment of the present disclosure, thepenetration of the external moisture may be effectively prevented by theencapsulating element 600.

Referring to FIG. 8B, the third encapsulating layer 630 extends downwardtowards the moisture-blocking hole BH to contact a side surface of thefirst encapsulating layer 610. The point END1 that the thirdencapsulating layer 630 contacts with the side surface of the firstencapsulating layer 610 horizontally overlaps with the over-coat layer140 as shown in the illustration. However, in a different embodiment, apoint that the third encapsulating layer 630 contacts with the sidesurface of the first encapsulating layer 610 may horizontally overlapwith a different layer (e.g., layer 150). The layers 640, 650 that issubsequently deposited over the third encapsulating layer 630 may have acorresponding shape (e.g., a V-shape, or a sawtooth like shape, or atriangular like shape) as shown in the illustration. The adhesive layer700 subsequently deposited over the layer 650 may also have acorresponding shape as the third encapsulating layer 630 (or the othersubsequently deposited layers).

In one embodiment, first, second, third, fourth, fifth encapsulatinglayers may have different thickness from each other. Further, they maybe arranged in a way that a layer that have a smaller thickness isinterposed between layers with greater thickness. For instance, thesecond encapsulating layer 620 is thicker than the first encapsulatinglayer 610, and the third encapsulating layer 630 is thinner than thesecond encapsulating layer 620, and the fourth encapsulating layer 640is thicker than the third encapsulating layer 630, and the fifthencapsulating layer 650 is thinner than the fourth encapsulating layer640.

In one embodiment, the first encapsulating layer 610 and the thirdencapsulating layer 630 and the fifth encapsulating layer 650 may havethe same thickness as each other. However, the present disclosure is notlimited to these example dimensions.

The display apparatus according to the embodiment of the presentdisclosure is described that the variable adhesive layer 700 is disposedbetween the third encapsulating layer 630 which is an inorganicencapsulating layer, and the front adhesive layer 800. However, in thedisplay apparatus according to another embodiment of the presentdisclosure, the variable adhesive layer 700 may be disposed betweenorganic layers. For example, in the display apparatus according toanother embodiment of the present disclosure, the variable adhesivelayer 700 may be disposed between the over-coat layer 140 and the frontadhesive layer 800 of the bezel area BZ, as shown in FIGS. 9, 10A and10B. The variable adhesive layer 700 may be spaced away from the displayarea AA. For example, the variable adhesive layer 700 may have a closedcurve shape extending along an edge of the display area AA. The variableadhesive layer 700 may be disposed outside the moisture-blocking holeBH. For example, the bank insulating layer 150, the light-emitting layer320, the second electrode 330 and the encapsulating element 600 may bedisposed in a region defined by the variable adhesive layer 700. Thevariable adhesive layer 700 may surround the encapsulating element 600.For example, the variable adhesive layer 700 may be spaced away from theencapsulating element 600.

The front adhesive layer 800 of the display area AA may be in directcontact with the third encapsulating layer 630 including an inorganicinsulating material. The front adhesive layer 800 may include an organicmaterial. For example, the front adhesive layer 800 may includeolefin-based material. In general, the interface between the organicfilm and the organic film is not easily separated, compared with theinterface between the inorganic film and the organic film. For example,one of the organic layers may be torn in the separation process of thestacked organic layers. Thus, in the display apparatus according toanother embodiment of the present disclosure, the front adhesive layer800 of the display area AA is in contact with the third encapsulatinglayer 630 including an inorganic insulating material, the variableadhesive layer 700 is disposed between the over-coat layer 140 and thefront adhesive layer 800 of the bezel area BZ, such that the damage ofthe light-emitting devices 300 due to the separation process of theencapsulation substrate 900 for re-work may be prevented. Therefore, inthe display apparatus according to another embodiment of the presentdisclosure, the process efficiency and the productivity may be greatlyimproved.

The display apparatus according to the embodiment of the presentdisclosure is described that the encapsulating element 600 has a stackedstructure of an inorganic encapsulating layer and an organicencapsulating layer, wherein the uppermost layer of the encapsulatingelement 600 is an inorganic encapsulating layer. However, in the displayapparatus according to another embodiment of the present disclosure, theencapsulating element 600 of the display area AA may have a stackedstructure of the first encapsulating layer 610, the second encapsulatinglayer 620, the third encapsulating layer 630 and the fourthencapsulating layer 640, as shown in FIGS. 11, 12A and 12B. That is, inthe display apparatus according to another embodiment of the presentdisclosure, the uppermost layer of the encapsulating element 600 in thedisplay area AA may be the fourth encapsulating layer 640 including anorganic insulating material. An inner variable adhesive layer 710 may bedisposed between the fourth encapsulating layer 640 and the frontadhesive layer 800 of the display area AA. Thus, in the displayapparatus according to another embodiment of the present disclosure, thedegree of freedom for the structure of the encapsulating element 600 maybe improved.

In the display apparatus according to another embodiment of the presentdisclosure, an outer variable adhesive layer 720 may be disposed betweenthe over-coat layer 140 and the front adhesive layer 800 of the bezelarea BZ. The outer variable adhesive layer 720 may include the samematerial as the inner variable adhesive layer 710. For example, theadhesive force of the inner variable adhesive layer 710 and the adhesiveforce of the outer variable adhesive layer 720 may be simultaneouslyreduced by ultraviolet (UV) irradiation. Thus, in the display apparatusaccording to another embodiment of the present disclosure, theseparation process of the encapsulation substrate 900 for re-work may bequickly performed.

The outer variable adhesive layer 720 may be spaced away from the innervariable adhesive layer 710. For example, the moisture-blocking hole BHmay be disposed between the inner variable adhesive layer 710 and outervariable adhesive layer 720. The encapsulating element 600 may includethe fifth encapsulating layer 650 covering an end of the fourthencapsulating layer 640 in the moisture-blocking hole BH. For example,the fifth encapsulating layer 650 may be disposed between the innervariable adhesive layer 710 and outer variable adhesive layer 720. Thus,in the display apparatus according to another embodiment of the presentdisclosure, the reliability bezel region may be expanded in the bezelarea BZ, the penetration of the external moisture may be prevented, andthe damage of the light-emitting devices 300 due to the separationprocess of the encapsulation substrate 900 may be prevented. Therefore,in the display apparatus according to another embodiment of the presentdisclosure, the process efficiency and the productivity may besignificantly improved.

In the result, the display apparatus according to the embodiments of thepresent disclosure may comprise the encapsulating element disposedbetween the second electrode of the light-emitting device and the frontadhesive layer, the variable adhesive layer disposed between theencapsulating element and the front adhesive layer, and themoisture-blocking hole disposed on the bezel area of the devicesubstrate, wherein at least a portion of the moisture-blocking hole maybe filled by the encapsulating element. Thus, in the display apparatusaccording to the embodiments of the present disclosure, the reliabilitybezel region may be expanded in the bezel area, the penetration of theexternal moisture may be prevented, and the damage of the light-emittingdevices due to the separation process of the encapsulation substrate forre-work may be prevented. Thereby, in the display apparatus according tothe embodiments of the present disclosure, the process efficiency andthe productivity may be improved.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

1. A display apparatus, comprising: a substrate including a display areaand a non-display area adjacent to the display area; a plurality ofpixels disposed in the display area; a gate driver disposed on bothsides of the display area in the non-display area, the gate driverincluding a plurality of stages including a first stage and a secondstage; and a plurality of gate lines extending from the gate driver tothe display area, wherein the plurality of gate lines include a firstgate line including a linear portion and coupled to the first stage, anda second gate line including a linear portion and a curved portion andcoupled to the second stage, and wherein a size of an area of the secondstage is larger than a size of an area of the first stage in plan view.2. The display apparatus of claim 1, wherein the display area includes aplurality of corner areas comprising a round shape and the second stageis disposed in the non-display area corresponding to the plurality ofcorner areas.
 3. The display apparatus of claim 2, wherein the displayarea includes a first display area and a second display area and a thirddisplay area extending from one portion of the first display area, thenon-display area is disposed between the second display area and thethird display area, and the second gate line is disposed in the seconddisplay area and the third display area.
 4. The display apparatus ofclaim 3, wherein the second display area and the third display areacorrespond to some corner areas of the plurality of corner areas, andthe second stage is disposed in a non-display area corresponding to thesecond display area and the third display area.
 5. The display apparatusof claim 3, wherein a boundary of the second display area and thenon-display area, and a boundary of the third display area and thenon-display area comprise a curved shape, and a curved portion of thesecond gate line is disposed along the boundary of the second displayarea and the non-display area and the boundary of the third display areaand the non-display area.
 6. The display apparatus of claim 2, furthercomprising: a camera area in the display area, wherein the second gateline is disposed in the display area on at least one or more sides ofthe camera area.
 7. The display apparatus of claim 6, wherein the cameraarea corresponds to some corner areas of the plurality of corner areas,and the second stage is disposed in the non-display area correspondingto the camera area.
 8. The display apparatus of claim 6, wherein anoutline of the camera area includes a curved shape and the curvedportion of the second gate line is disposed along a boundary of thecamera area.
 9. The display apparatus of claim 1, wherein each of theplurality of stages includes a buffer transistor and an area size of thebuffer transistor of the second stage is larger than an area size of thebuffer transistor of the first stage.
 10. The display apparatus of claim9, wherein the plurality of stages further comprises a third stage, thefirst stage and the second stage are stages which normally outputsignals, the third stage is a dummy stage which does not output asignal, and the third stage is a previous stage or a subsequent stage ofthe second stage.
 11. The display apparatus of claim 10, wherein an areasize in plan view of the third stage is smaller than an area size inplan view of the first stage and an area size in plan view of the secondstage.
 12. The display apparatus of claim 11, wherein an area size inplan view of the buffer transistor of the third stage is smaller than anarea size in plan view of the buffer transistor of the first stage andan area size in plan view of the buffer transistor of the second stage.13. The display apparatus of claim 9, wherein an interval between thesecond stage and a previous stage of the second stage is different froman interval between the second stage and a subsequent stage of thesecond stage.
 14. A display apparatus, comprising: a plurality of pixelsdisposed in a display area; a gate driver disposed in a non-display areaadjacent to the display area, the gate driver including a plurality ofstages including a first stage, a second stage, and a third stageadjacent to each other, the first stage including a first scan buffertransistor, the second stage including a second scan buffer transistor,and the third stage including a third scan buffer transistor, the thirdstage being a dummy output scan stage, and the third scan buffertransistor being a dummy scan buffer transistor; and a plurality of gatelines extending from the gate driver to the display area, the pluralityof gate lines including a first gate line coupled to the first stage, asecond gate line coupled to the second stage, and a third gate linecoupled to the third stage, wherein an area of the second stage from aplan view is larger than an area of the first stage.
 15. The displayapparatus of claim 14, wherein the first gate line includes only alinear portion within the display area extending in a first directionand the second gate line includes both at least one linear portion andat least one curved portion, the at least one linear portion of thesecond gate line extending in a second direction transverse to the firstdirection.
 16. The display apparatus of claim 15, wherein the at leastone curved portion of the second gate line is curved according to ashape of the non-display area.
 17. The display apparatus of claim 14,wherein an area of the third stage is equal to or smaller than one ofthe first stage and the second stage that output a signal.
 18. Thedisplay apparatus of claim 14, wherein the first stage includes a firstadditional scan circuit adjacent and coupled to the first scan buffertransistor, the second stage includes a second additional scan circuitadjacent and coupled to the second scan buffer transistor, the thirdstage includes a third additional scan circuit adjacent and coupled tothe third scan buffer transistor, and wherein the first additional scancircuit, the second additional scan circuit, and the third additionalscan circuit have a same area from a plan view.
 19. The displayapparatus of claim 14, wherein the first stage, the second stage, andthe third stage are not evenly spaced apart from each other.
 20. Adisplay apparatus, comprising: a plurality of pixels disposed in adisplay area; a non-display area adjacent to the display area, thenon-display area including a first bezel area adjacent to one side ofthe display area and a second bezel area adjacent to the other side ofthe display area opposite the first bezel area; a gate driver disposedin the non-display area, the gate driver including a plurality of stagesincluding: a normal output scan stage, in operation, output a scansignal; and a dummy output scan stage, in operation, does not output ascan signal; and a plurality of gate lines extending from the gatedriver to the display area, the plurality of gate lines including afirst gate line coupled to a normal output scan stage in the first bezelarea, wherein the first bezel area includes only the normal output scanstage and not the dummy output scan stage among the plurality of stages.